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XCZU4EG-1SFVC784E — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
AMD / Xilinx

XCZU4EG-1SFVC784E

Integrated Circuits (ICs) · 784-FCBGA · Embedded - System On Chip (SoC)
In stock at ZDI Part Status: Active In demand
Data last refreshed Jul 27, 2026
Manufacturer
AMD / Xilinx
Mfr Part #
XCZU4EG-1SFVC784E
Series
Zynq® UltraScale+™ MPSoC EG
Category
Integrated Circuits (ICs)
Datasheet
View datasheet ↗
Availability & Pricing
ZDI Stock1800 pcs
Unit PriceRequest a Quote
Sourcing channels20
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Live pricing on request · most quotes same business day

Product Attributes

Electrical & Parametric
Primary ProcessorQuad-core ARM Cortex-A53 MPCore (up to 1.2GHz)
Secondary ProcessorDual-core ARM Cortex-R5F MPCore (up to 500MHz)
Graphics ProcessorARM Mali-400 MP2 (up to 667MHz)
System Logic Cells192,150
Clb Flip-Flops175,680
Clb Luts87,840
Distributed Ram2.1 Mb
Block Ram4.5 Mb (128 Blocks)
Ultraram9.6 Mb (32 Blocks)
Total On-Chip Ram14.1 Mb
Dsp Slices728
On-Chip Memory (Ocm)256 KB
Ps I/O Pins214
Pl User I/O Pins252
High-Density (Hd) I/O Pins96
High-Performance (Hp) I/O Pins156
Ps-Gtr Transceivers4
Gth Transceivers4
Speed Grade-1
Temperature GradeE (Extended)
Operating Junction Temperature0°C ~ 100°C
Package / Case784-FCBGA (23x23 mm)
Pin Count784
Ball Pitch0.8 mm
Mounting TypeSurface Mount
Physical & Thermal
Package / Case784-FCBGA
Mounting TypeSurface Mount
SeriesZynq® UltraScale+™ MPSoC EG
Operating Temperature0°C ~ 100°C (TJ)
Classification & Lifecycle
CategoryIntegrated Circuits (ICs)
TypeEmbedded - System On Chip (SoC)
Part StatusActive

Zynq UltraScale+ MPSoC EG device featuring a Quad-Core ARM Cortex-A53, Dual-Core ARM Cortex-R5F, ARM Mali-400 MP2 GPU, and 192,150 System Logic Cells in a 784-ball FCBGA package.

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant

Availability & Sourcing

21 source rows · masked
SourceMfrQtyDate CodeConditionStatus
ZDI Stock AMD / Xilinx 1800 NEW In Stock RFQ
Live 94 Live · fresh RFQ
Live XILINX 1800 Live · fresh RFQ
Live AMD 240 Live · fresh RFQ
Live XILINX 22 Live · fresh RFQ
Live XILINX 15 1921+ Live · fresh RFQ
Live XILINX 480 25+ Live · fresh RFQ
Live Xilinx(???) 5565 25+ Live · fresh RFQ
Live AMD Xilinx 3000 25+ Live · fresh RFQ
Live AMD 2000 2024+ Live · fresh RFQ
Live XILINX(???) 1765 Live · fresh RFQ
Market XILINX 94 Available RFQ
Market XILINX 1800 Available RFQ
Market AMD 240 Available RFQ
Market XILINX 22 Available RFQ
Market XILINX 15 1921+ Available RFQ
Market XILINX 480 25+ Available RFQ
Market Xilinx(???) 5565 25+ Available RFQ
Market AMD Xilinx 3000 25+ Available RFQ
Market AMD 2000 2024+ Available RFQ
Market XILINX(???) 1765 Available RFQ

ZDI Stock — held in our warehouse · Market — recent offers, sourced on request · Live — fresh from the broker network. Supplier identity and cost are never shown.

Part Activity

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Live search & sourcing activity for XCZU4EG-1SFVC784E — real inquiries only.

Engineering FAQ

answers from this part's real data
What quantity and packaging is XCZU4EG-1SFVC784E in ZDI stock?
ZDI holds 1,800 pcs. Request a quote for confirmed quantity, lead time, and pricing.
What are the key specifications of XCZU4EG-1SFVC784E?
Primary Processor: Quad-core ARM Cortex-A53 MPCore (up to 1.2GHz); Secondary Processor: Dual-core ARM Cortex-R5F MPCore (up to 500MHz); Graphics Processor: ARM Mali-400 MP2 (up to 667MHz); System Logic Cells: 192,150; Clb Flip-Flops: 175,680; Clb Luts: 87,840.
What package is XCZU4EG-1SFVC784E supplied in?
XCZU4EG-1SFVC784E is supplied in the 784-FCBGA package, surface mount, rated 0°C ~ 100°C (TJ).
Can ZDI source XCZU4EG-1SFVC784E beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
Source-country supplier analysis, rating & review
Incoming inspection, RoHS verification, bake, full lot traceability
ESD-controlled handling · authentic parts guaranteed

Related Parts

from AMD / Xilinx

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