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XCZU4EG-1SFVC784E — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
AMD

XCZU4EG-1SFVC784E

Integrated Circuits (ICs) · 784-BFBGA, FCBGA · Embedded - System On Chip (SoC)
Part Status: Active In demand
Data last refreshed Sep 8, 2026
Manufacturer
AMD
Mfr Part #
XCZU4EG-1SFVC784E
Series
Zynq® UltraScale+™ MPSoC EG
Category
Integrated Circuits (ICs)
Datasheet
View datasheet ↗
Availability & Pricing
Unit PriceRequest a Quote
Sourcing channels20
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Product Attributes

Electrical & Parametric
Application Processing Unit (Apu)Quad-core Arm Cortex-A53 MPCore up to 1.2 GHz
Real-Time Processing Unit (Rpu)Dual-core Arm Cortex-R5F MPCore up to 500 MHz
Graphics Processing Unit (Gpu)Arm Mali-400 MP2 up to 600 MHz
System Logic Cells192,150
Clb Flip-Flops175,680
Clb Luts87,840
Distributed Ram2.6 Mb
Block Ram4.5 Mb (128 blocks)
Ultraram13.5 Mb (48 blocks)
Total On-Chip Ram20.6 Mb
Dsp Slices728
High-Performance (Hp) I/O Count156
High-Density (Hd) I/O Count96
Total Programmable Logic I/O Pins252
Ps-Gtr Transceiver Channels4
Ps-Gtr Transceiver Maximum Data Rate6.0 Gb/s
Gth Transceiver Channels4
Gth Transceiver Maximum Data Rate12.5 Gb/s
Ps On-Chip Memory (Ocm)256 KB
Internal Core Voltage (Vccint)0.85 V
Operating Junction Temperature0°C to 100°C
Ball Pitch0.8 mm
Package Dimensions23 mm x 23 mm
Physical & Thermal
Package / Case784-BFBGA, FCBGA
Mounting TypeSurface Mount
SeriesZynq® UltraScale+™ MPSoC EG
Operating Temperature0°C ~ 100°C (TJ)
Classification & Lifecycle
CategoryIntegrated Circuits (ICs)
TypeEmbedded - System On Chip (SoC)
Part StatusActive

Zynq UltraScale+ MPSoC EG device featuring a Quad-Core ARM Cortex-A53, Dual-Core ARM Cortex-R5F, ARM Mali-400 MP2 GPU, and 192,150 System Logic Cells in a 784-ball FCBGA package.

Environmental & Export Classifications

RoHS Status
ROHS3 Compliant

Availability & Sourcing

20 sources
SourceMfrQtyDate CodeConditionStatus
Live — 94 — — Live RFQ
Live XILINX 1800 — — Live RFQ
Live AMD 240 — — Live RFQ
Live XILINX 22 — — Live RFQ
Live XILINX 15 1921+ — Live RFQ
Live XILINX 480 25+ — Live RFQ
Live Xilinx(???) 5565 25+ — Live RFQ
Live AMD Xilinx 3000 25+ — Live RFQ
Live AMD 2000 2024+ — Live RFQ
Live XILINX(???) 1765 — — Live RFQ
Market XILINX 94 — — Available RFQ
Market XILINX 1800 — — Available RFQ
Market AMD 240 — — Available RFQ
Market XILINX 22 — — Available RFQ
Market XILINX 15 1921+ — Available RFQ
Market XILINX 480 25+ — Available RFQ
Market Xilinx(???) 5565 25+ — Available RFQ
Market AMD Xilinx 3000 25+ — Available RFQ
Market AMD 2000 2024+ — Available RFQ
Market XILINX(???) 1765 — — Available RFQ

ZDI Stock — in our warehouse · Market — offers available through our sourcing network · Live — recent offers from our sourcing network.

Part Activity

recent searches, RFQs & offers
XCZU4EG-1SFVC784E viewed on the web · Web User
XCZU4EG-1SFVC784E viewed on the web · Web User
XCZU4EG-1SFVC784E viewed on the web · Web User
Part record updated by gemini enrichment — manufacturer, description, category, package, specs, lifecycle, datasheet, RoHS, REACH, ECCN, HTSUS, MSL · ZDI
Specifications reviewed & updated · ZDI
XCZU4EG-1SFVC784E viewed on the web · Web User
XCZU4EG-1SFVC784E viewed on the web · Web User
XCZU4EG-1SFVC784E viewed on the web · Web User

Recent search and sourcing activity for XCZU4EG-1SFVC784E.

Engineering FAQ

What are the key specifications of XCZU4EG-1SFVC784E?
Application Processing Unit (Apu): Quad-core Arm Cortex-A53 MPCore up to 1.2 GHz; Real-Time Processing Unit (Rpu): Dual-core Arm Cortex-R5F MPCore up to 500 MHz; Graphics Processing Unit (Gpu): Arm Mali-400 MP2 up to 600 MHz; System Logic Cells: 192,150; Clb Flip-Flops: 175,680; Clb Luts: 87,840.
What package is XCZU4EG-1SFVC784E supplied in?
XCZU4EG-1SFVC784E is supplied in the 784-BFBGA, FCBGA package, surface mount, rated 0°C ~ 100°C (TJ).
Can ZDI source XCZU4EG-1SFVC784E beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

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