800-219-9001 RFQ
THGBM5G7A2JBAIR — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Toshiba

THGBM5G7A2JBAIR

eMMC NAND Flash · BGA 153-ball · Memory
Part Status: Obsolete
Data last refreshed Jul 28, 2026
Manufacturer
Toshiba
Mfr Part #
THGBM5G7A2JBAIR
Series
THGBM5G
Category
eMMC NAND Flash
Datasheet
View datasheet ↗
Availability & Pricing
Unit PriceRequest a Quote
Request a Quote → Check Live Availability

Live pricing on request · most quotes same business day

Product Attributes

Electrical & Parametric
Capacity16 GB
InterfaceeMMC 4.41
Physical & Thermal
Package / CaseBGA 153-ball
Mounting TypeSurface Mount
SeriesTHGBM5G
Operating Temperature-25°C ~ 85°C
Classification & Lifecycle
CategoryeMMC NAND Flash
TypeMemory
Part StatusObsolete

16 GB eMMC 4.41 NAND flash memory module

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

recent searches, RFQs & offers
THGBM5G7A2JBAIR viewed on the web · Web User
THGBM5G7A2JBAIR viewed on the web · Web User
Specifications reviewed & updated · ZDI

Recent search and sourcing activity for THGBM5G7A2JBAIR.

Engineering FAQ

THGBM5G7A2JBAIR is marked Obsolete — how does ZDI assure authenticity?
Obsolete and end-of-life parts carry elevated counterfeit risk, which is exactly why ZDI routes every lot through the full EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with source-country supplier vetting and full lot traceability before release.
What are the key specifications of THGBM5G7A2JBAIR?
Capacity: 16 GB; Interface: eMMC 4.41.
What package is THGBM5G7A2JBAIR supplied in?
THGBM5G7A2JBAIR is supplied in the BGA 153-ball package, surface mount, rated -25°C ~ 85°C.
Can ZDI source THGBM5G7A2JBAIR beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

THGBM5G7A2JBAIR is marked Obsolete. Obsolete and end-of-life parts carry elevated counterfeit risk — exactly why ZDI routes them through the full EQuality Process™ with source-country supplier vetting, inspection, and traceability.

Related Parts

from Toshiba

Need THGBM5G7A2JBAIR?

ZD Integrated Circuits sources hard-to-find, obsolete, and excess components worldwide — pricing and availability, fast.

Request a Quote →