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SAMPLACM-AS4C16M16S-6BIN — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

SAMPLACM-AS4C16M16S-6BIN

SDRAM · 54-ball TFBGA · Memory
Part Status: Active
Data last refreshed Aug 1, 2026
Manufacturer
Alliance Memory
Mfr Part #
SAMPLACM-AS4C16M16S-6BIN
Series
AS4C
Category
SDRAM
Datasheet
View datasheet ↗
Availability & Pricing
Est. market range$2.50 – $6.50
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Product Attributes

Electrical & Parametric
Density256Mb
Organization16M x 16
Speed166MHz
Voltage3.3V
Physical & Thermal
Package / Case54-ball TFBGA
Mounting TypeSurface Mount
SeriesAS4C
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategorySDRAM
TypeMemory
Part StatusActive

256Mb (16M×16) SDR SDRAM, 166MHz, 3.3V, industrial temp

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Price History & Market Reference

Market Price Range

High$6.50
Low$2.50
Last$4.50
Price as of2026-08-01

ZDI Transaction

ZDI priceQuote on request

Pricing reflects ZDI's transaction and market-reference data. Firm pricing confirmed per RFQ against current availability.

Part Activity

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Recent search and sourcing activity for SAMPLACM-AS4C16M16S-6BIN.

Engineering FAQ

What are the key specifications of SAMPLACM-AS4C16M16S-6BIN?
Density: 256Mb; Organization: 16M x 16; Speed: 166MHz; Voltage: 3.3V.
What package is SAMPLACM-AS4C16M16S-6BIN supplied in?
SAMPLACM-AS4C16M16S-6BIN is supplied in the 54-ball TFBGA package, surface mount, rated -40°C ~ 85°C.
Can ZDI source SAMPLACM-AS4C16M16S-6BIN beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

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