800-219-9001 RFQ
LPC3250FET296,551 — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
NXP Semiconductors

LPC3250FET296,551

Microcontroller · TFBGA-296 · Microcontroller
Part Status: NRND
Data last refreshed Jul 28, 2026
Manufacturer
NXP Semiconductors
Mfr Part #
LPC3250FET296,551
Series
LPC32xx
Category
Microcontroller
Datasheet
View datasheet ↗
Availability & Pricing
Unit PriceRequest a Quote
Request a Quote → Check Live Availability

Live pricing on request · most quotes same business day

Product Attributes

Electrical & Parametric
CoreARM926EJ-S
Max Clock266 MHz
Sram256 kB
Package Size15x15 mm
Physical & Thermal
Package / CaseTFBGA-296
Mounting TypeSurface Mount
SeriesLPC32xx
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategoryMicrocontroller
TypeMicrocontroller
Part StatusNRND

ARM926EJ-S MCU, 266 MHz, 256 kB SRAM, LCD, USB OTG, Ethernet, 296-ball TFBGA

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

recent searches, RFQs & offers
LPC3250FET296,551 viewed on the web · Web User
LPC3250FET296,551 viewed on the web · Web User
LPC3250FET296,551 viewed on the web · Web User
LPC3250FET296,551 viewed on the web · Web User
Specifications reviewed & updated · ZDI

Recent search and sourcing activity for LPC3250FET296,551.

Engineering FAQ

What are the key specifications of LPC3250FET296,551?
Core: ARM926EJ-S; Max Clock: 266 MHz; Sram: 256 kB; Package Size: 15x15 mm.
What package is LPC3250FET296,551 supplied in?
LPC3250FET296,551 is supplied in the TFBGA-296 package, surface mount, rated -40°C ~ 85°C.
Can ZDI source LPC3250FET296,551 beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

Related Parts

from NXP Semiconductors

Need LPC3250FET296,551?

ZD Integrated Circuits sources hard-to-find, obsolete, and excess components worldwide — pricing and availability, fast.

Request a Quote →