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AS6C4016-55BIN — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

AS6C4016-55BIN

SRAM · BGA-48 · Memory
Part Status: Active
Data last refreshed Jul 27, 2026
Manufacturer
Alliance Memory
Mfr Part #
AS6C4016-55BIN
Series
AS6C4016
Category
SRAM
Datasheet
View datasheet ↗
Availability & Pricing
Unit PriceRequest a Quote
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AS6C4016-55BIN Replaces

Alliance Memory published cross-reference

Alliance Memory lists AS6C4016-55BIN as a drop-in replacement for the parts below. Confirm speed grade, temperature range and package against the datasheet before substituting.

ManufacturerPartTechnologyDensityOrganization
BRILLIANCE SEMI BS616LV4017EIP-55 Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62146ELL-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62146ESL-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62146EV30LL-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62147EV30LL-45ZSXI Low Power Asynchronous SRAM4M256K x 16
ISSI IS62WV25616BLL-55TLI Low Power Asynchronous SRAM4M256K x 16
Samsung Electronics Co Ltd K6X4016C3F-TF70000 Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62146G-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62146GN-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62147G-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62147G30-45ZSXI/A Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62147GE-45ZSXI Low Power Asynchronous SRAM4M256K x 16
Cypress Semiconductor Corp CY62147GN30-45ZSXI Low Power Asynchronous SRAM4M256K x 16
ISSI IS62WV25616DBLL-45/55TLI Low Power Asynchronous SRAM4M256K x 16
ISSI IS62WV25616EBLL-45/55TLI Low Power Asynchronous SRAM4M256K x 16
ISSI IS65WV25616DBLL-45CTLA1 Low Power Asynchronous SRAM4M256K x 16
ISSI IS65WV25616EBLL-45CTLA1 Low Power Asynchronous SRAM4M256K x 16
RENESAS RMLV0414EGSB-4S2 Low Power Asynchronous SRAM4M256K x 16
RENESAS RMLV0416EGSB-4S2 Low Power Asynchronous SRAM4M256K x 16
Source: Alliance Memory published cross-reference data · alliancememory.com ↗

Product Attributes

Electrical & Parametric
Memory Size4Mb
Organization256K x 16
Access Time55 ns
Physical & Thermal
Package / CaseBGA-48
Mounting TypeSurface Mount
SeriesAS6C4016
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategorySRAM
TypeMemory
Part StatusActive

4Mb (256K x 16) CMOS SRAM, 55 ns access time

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

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Recent search and sourcing activity for AS6C4016-55BIN.

Engineering FAQ

Which parts does AS6C4016-55BIN replace?
Alliance Memory lists AS6C4016-55BIN as a drop-in replacement for BRILLIANCE SEMI BS616LV4017EIP-55, Cypress Semiconductor Corp CY62146ELL-45ZSXI, Cypress Semiconductor Corp CY62146ESL-45ZSXI, Cypress Semiconductor Corp CY62146EV30LL-45ZSXI, Cypress Semiconductor Corp CY62147EV30LL-45ZSXI, …. Confirm speed grade, temperature range and package against the datasheet before substituting.
What are the key specifications of AS6C4016-55BIN?
Memory Size: 4Mb; Organization: 256K x 16; Access Time: 55 ns.
What package is AS6C4016-55BIN supplied in?
AS6C4016-55BIN is supplied in the BGA-48 package, surface mount, rated -40°C ~ 85°C.
Can ZDI source AS6C4016-55BIN beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

Related Parts

from Alliance Memory

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