800-219-9001 RFQ
AS6C2016-55BIN — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

AS6C2016-55BIN

SRAM · 48-ball BGA · Memory
Part Status: Active
Data last refreshed Jul 27, 2026
Manufacturer
Alliance Memory
Mfr Part #
AS6C2016-55BIN
Series
AS6C2016
Category
SRAM
Datasheet
View datasheet ↗
Availability & Pricing
Unit PriceRequest a Quote
Request a Quote → Check Live Availability

Live pricing on request · most quotes same business day

AS6C2016-55BIN Replaces

Alliance Memory published cross-reference

Alliance Memory lists AS6C2016-55BIN as a drop-in replacement for the parts below. Confirm speed grade, temperature range and package against the datasheet before substituting.

ManufacturerPartTechnologyDensityOrganization
Samsung Electronics Co Ltd K6F2016U4E-EF55000 Low Power Asynchronous SRAM2M128K x 16
Cypress Semiconductor Corp 62137EV30LL-45BVXI Low Power Asynchronous SRAM2M128K x 16
Cypress Semiconductor Corp 62137FV30LL-45BVXI Low Power Asynchronous SRAM2M128K x 16
BRILLIANCE SEMI BS616LV2019AIG-55 Low Power Asynchronous SRAM2M128K x 16
Cypress Semiconductor Corp CY62136E/FV30LL-45BVXI Low Power Asynchronous SRAM2M128K x 16
ISSI IS62WV12816BLL-45/55BLI Low Power Asynchronous SRAM2M128K x 16
ISSI IS62WV12816DBLL-35/45/55BLI Low Power Asynchronous SRAM2M128K x 16
ISSI IS62WV12816EBLL-45/55BLI Low Power Asynchronous SRAM2M128K x 16
ISSI IS62WV12816FBLL-45BLI Low Power Asynchronous SRAM2M128K x 16
Source: Alliance Memory published cross-reference data · alliancememory.com ↗

Product Attributes

Electrical & Parametric
Voltage2.7V ~ 3.6V
Organization128K x 16
Access Time55 ns
Physical & Thermal
Package / Case48-ball BGA
Mounting TypeSurface Mount
SeriesAS6C2016
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategorySRAM
TypeMemory
Part StatusActive

2 Mbit (128K x 16) Low Power CMOS SRAM, 55 ns

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

recent searches, RFQs & offers
AS6C2016-55BIN viewed on the web · Web User
AS6C2016-55BIN viewed on the web · Web User
AS6C2016-55BIN viewed on the web · Web User
AS6C2016-55BIN viewed on the web · Web User
AS6C2016-55BIN viewed on the web · Web User
AS6C2016-55BIN searched via the web · Web User
Specifications reviewed & updated · ZDI

Recent search and sourcing activity for AS6C2016-55BIN.

Engineering FAQ

Which parts does AS6C2016-55BIN replace?
Alliance Memory lists AS6C2016-55BIN as a drop-in replacement for Samsung Electronics Co Ltd K6F2016U4E-EF55000, Cypress Semiconductor Corp 62137EV30LL-45BVXI, Cypress Semiconductor Corp 62137FV30LL-45BVXI, BRILLIANCE SEMI BS616LV2019AIG-55, Cypress Semiconductor Corp CY62136E/FV30LL-45BVXI, …. Confirm speed grade, temperature range and package against the datasheet before substituting.
What are the key specifications of AS6C2016-55BIN?
Voltage: 2.7V ~ 3.6V; Organization: 128K x 16; Access Time: 55 ns.
What package is AS6C2016-55BIN supplied in?
AS6C2016-55BIN is supplied in the 48-ball BGA package, surface mount, rated -40°C ~ 85°C.
Can ZDI source AS6C2016-55BIN beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

Related Parts

from Alliance Memory

Need AS6C2016-55BIN?

ZD Integrated Circuits sources hard-to-find, obsolete, and excess components worldwide — pricing and availability, fast.

Request a Quote →