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AS6C1016-55BIN — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

AS6C1016-55BIN

SRAM · 48-ball BGA · Memory
Part Status: Active
Data last refreshed Jul 27, 2026
Manufacturer
Alliance Memory
Mfr Part #
AS6C1016-55BIN
Series
AS6C1016
Category
SRAM
Datasheet
View datasheet ↗
Availability & Pricing
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AS6C1016-55BIN Replaces

Alliance Memory published cross-reference

Alliance Memory lists AS6C1016-55BIN as a drop-in replacement for the parts below. Confirm speed grade, temperature range and package against the datasheet before substituting.

ManufacturerPartTechnologyDensityOrganization
BRILLIANCE SEMI BS616LV1010AI-70 Low Power Asynchronous SRAM1M64K x 16
Cypress Semiconductor Corp CY62126EV30LL-45BVXI Low Power Asynchronous SRAM1M64K x 16
Samsung Electronics Co Ltd K6F1016U4C-EF55 Low Power Asynchronous SRAM1M64K x 16
ISSI IS62WV6416BLL-45/55BLI Low Power Asynchronous SRAM1M64K x 16
ISSI IS62WV6416DBLL-45BLI Low Power Asynchronous SRAM1M64K x 16
ISSI IS62WV6416FBLL-45BLI Low Power Asynchronous SRAM1M64K x 16
Source: Alliance Memory published cross-reference data · alliancememory.com ↗

Product Attributes

Electrical & Parametric
Capacity1 Mb
Organization64K x 16
Access Time55 ns
Voltage2.7V ~ 3.6V
Physical & Thermal
Package / Case48-ball BGA
Mounting TypeSurface Mount
SeriesAS6C1016
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategorySRAM
TypeMemory
Part StatusActive

1 Mb (64K × 16) CMOS SRAM, 55 ns, 2.7–3.6 V

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

recent searches, RFQs & offers
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AS6C1016-55BIN viewed on the web · Web User
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Specifications reviewed & updated · ZDI

Recent search and sourcing activity for AS6C1016-55BIN.

Engineering FAQ

Which parts does AS6C1016-55BIN replace?
Alliance Memory lists AS6C1016-55BIN as a drop-in replacement for BRILLIANCE SEMI BS616LV1010AI-70, Cypress Semiconductor Corp CY62126EV30LL-45BVXI, Samsung Electronics Co Ltd K6F1016U4C-EF55, ISSI IS62WV6416BLL-45/55BLI, ISSI IS62WV6416DBLL-45BLI, …. Confirm speed grade, temperature range and package against the datasheet before substituting.
What are the key specifications of AS6C1016-55BIN?
Capacity: 1 Mb; Organization: 64K x 16; Access Time: 55 ns; Voltage: 2.7V ~ 3.6V.
What package is AS6C1016-55BIN supplied in?
AS6C1016-55BIN is supplied in the 48-ball BGA package, surface mount, rated -40°C ~ 85°C.
Can ZDI source AS6C1016-55BIN beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

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