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AS4C16M16MD1-6BCNTR — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

AS4C16M16MD1-6BCNTR

Mobile DDR SDRAM · 60-ball FBGA · Memory
Part Status: Active
Data last refreshed Jul 27, 2026
Manufacturer
Alliance Memory
Mfr Part #
AS4C16M16MD1-6BCNTR
Series
AS4C16M16MD1
Category
Mobile DDR SDRAM
Datasheet
View datasheet ↗
Availability & Pricing
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AS4C16M16MD1-6BCNTR Replaces

Alliance Memory published cross-reference

Alliance Memory lists AS4C16M16MD1-6BCNTR as a drop-in replacement for the parts below. Confirm speed grade, temperature range and package against the datasheet before substituting.

ManufacturerPartTechnologyDensityOrganization
Micron Technology Inc MT46H16M16LFBF-6 MOBILE LP DDR1256Mb16M x 16
SK Hynix H5MS2562 MOBILE LP DDR1256Mb16M x 16
SK Hynix HY5MS5B6 MOBILE LP DDR1256Mb16M x 16
ISSI IS43LR16160 MOBILE LP DDR1256Mb16M x 16
Samsung Electronics Co Ltd K4X56163SPN MOBILE LP DDR1256Mb16M x 16
ESMT M53D2561616A-6BG2F MOBILE LP DDR1256Mb16M x 16
Nanya NT6DM16M16AD-T1 MOBILE LP DDR1256Mb16M x 16
Winbond W948D6FBHX MOBILE LP DDR1256Mb16M x 16
Source: Alliance Memory published cross-reference data · alliancememory.com ↗

Product Attributes

Electrical & Parametric
Density256 Mb
Organization16M x 16
Voltage1.8 V
Speed6 ns
Physical & Thermal
Package / Case60-ball FBGA
Mounting TypeSurface Mount
SeriesAS4C16M16MD1
Operating Temperature-25°C ~ 85°C
Classification & Lifecycle
CategoryMobile DDR SDRAM
TypeMemory
Part StatusActive

256Mb Mobile DDR SDRAM, 166 MHz, 1.8 V, 16-bit data width

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

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Recent search and sourcing activity for AS4C16M16MD1-6BCNTR.

Engineering FAQ

Which parts does AS4C16M16MD1-6BCNTR replace?
Alliance Memory lists AS4C16M16MD1-6BCNTR as a drop-in replacement for Micron Technology Inc MT46H16M16LFBF-6, SK Hynix H5MS2562, SK Hynix HY5MS5B6, ISSI IS43LR16160, Samsung Electronics Co Ltd K4X56163SPN, …. Confirm speed grade, temperature range and package against the datasheet before substituting.
What are the key specifications of AS4C16M16MD1-6BCNTR?
Density: 256 Mb; Organization: 16M x 16; Voltage: 1.8 V; Speed: 6 ns.
What package is AS4C16M16MD1-6BCNTR supplied in?
AS4C16M16MD1-6BCNTR is supplied in the 60-ball FBGA package, surface mount, rated -25°C ~ 85°C.
Can ZDI source AS4C16M16MD1-6BCNTR beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

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