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AS4C16M16D1-5BIN — BGA / FBGA package (representative)
BGA / FBGA
Representative of package type
Alliance Memory

AS4C16M16D1-5BIN

DDR SDRAM · 60-ball FBGA · Memory
Data last refreshed Jul 27, 2026
Manufacturer
Alliance Memory
Mfr Part #
AS4C16M16D1-5BIN
Series
AS4C16M16D1
Category
DDR SDRAM
Datasheet
View datasheet ↗
Availability & Pricing
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AS4C16M16D1-5BIN Replaces

Alliance Memory published cross-reference

Alliance Memory lists AS4C16M16D1-5BIN as a drop-in replacement for the parts below. Confirm speed grade, temperature range and package against the datasheet before substituting.

ManufacturerPartTechnologyDensityOrganization
SK Hynix HY5DU561622 DDR1 2.5V SDRAM256Mb16M x 16
Samsung Electronics Co Ltd K4H561638D DDR1 2.5V SDRAM256Mb16M x 16
Micron Technology Inc MT46V16M16CY-5B DDR1 2.5V SDRAM256Mb16M x 16
ISSI IS43R16160 DDR1 2.5V SDRAM256Mb16M x 16
ISSI IS46R16160 DDR1 2.5V SDRAM256Mb16M x 16
ESMT M13S2561616A-xBG2A DDR1 2.5V SDRAM256Mb16M x 16
Winbond W9425G6JB DDR1 2.5V SDRAM256Mb16M x 16
Source: Alliance Memory published cross-reference data · alliancememory.com ↗

Product Attributes

Electrical & Parametric
Density256 Mb
Organization16M x 16
Voltage2.5 V
Speed200 MHz
Physical & Thermal
Package / Case60-ball FBGA
Mounting TypeSurface Mount
SeriesAS4C16M16D1
Operating Temperature-40°C ~ 85°C
Classification & Lifecycle
CategoryDDR SDRAM
TypeMemory

256Mb (16M x 16) DDR SDRAM, 2.5V, 200 MHz

Environmental & Export Classifications

RoHS Status
RoHS Compliant

Part Activity

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Recent search and sourcing activity for AS4C16M16D1-5BIN.

Engineering FAQ

Which parts does AS4C16M16D1-5BIN replace?
Alliance Memory lists AS4C16M16D1-5BIN as a drop-in replacement for SK Hynix HY5DU561622, Samsung Electronics Co Ltd K4H561638D, Micron Technology Inc MT46V16M16CY-5B, ISSI IS43R16160, ISSI IS46R16160, …. Confirm speed grade, temperature range and package against the datasheet before substituting.
What are the key specifications of AS4C16M16D1-5BIN?
Density: 256 Mb; Organization: 16M x 16; Voltage: 2.5 V; Speed: 200 MHz.
What package is AS4C16M16D1-5BIN supplied in?
AS4C16M16D1-5BIN is supplied in the 60-ball FBGA package, surface mount, rated -40°C ~ 85°C.
Can ZDI source AS4C16M16D1-5BIN beyond the quantities shown?
Yes — ZD Integrated Circuits specializes in sourcing hard-to-find, obsolete, and excess electronic components through its global network, with counterfeit-avoidance inspection on every lot. Submit an RFQ with your target quantity for availability and pricing.

Documents & Media

Quality & Counterfeit Avoidance

ISO 9001 ERAI Member ESD Certified GIDEP Participant ZDI EQuality Process CAGE Code 1V8K2

ZD Integrated Circuits operates an ISO 9001-certified quality system incorporating JEDEC-standard process-control elements. In an era of global sourcing and internet procurement, standards compliance alone no longer assures component authenticity — so ZDI pioneered a multi-layered counterfeit-avoidance program: supplier analysis at the source-country level, detailed component analysis, defined inspection standards for all incoming devices, and stringent supplier rating and review. These programs let ZDI guarantee the integrity and the source of every component it ships.

Every lot moves through ZDI's EQuality Process™ — validation, QI-1 and QI-2/camera inspection, RoHS verification, bake and bag-and-tag, and QI-3 final inspection — with Quality-Manager disposition before release. Nonconforming material is quarantined; conforming material is warehoused or shipped.

✓Multi-stage EQuality Process™ inspection (QI-1 · QI-2/camera · QI-3)
✓Source-country supplier analysis, rating & review
✓Incoming inspection, RoHS verification, bake, full lot traceability
✓ESD-controlled handling · authentic parts guaranteed

Related Parts

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